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VSMY2850RG, VSMY2850G
www.vishay.com
Vishay Semiconductors
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
0°
10°
20°
30°
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
40°
transportation and storage. Each bag contains a desiccant.
1.0
0.9
0.8
50°
60°
70°
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
0.7
80°
Conditions: T amb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
21111
0.6
0.4
0.2
0
DRYING
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
SOLDER PROFILE
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
300
250
255 °C
240 °C
max. 26 0 °C
245 °C
217 °C
200
max. 30 s
150
100
max. 120 s
max. 100 s
50
0
max. ramp up 3 °C/s max. ramp down 6 °C/s
0
50
100
150
200
250
300
19841
Time (s)
Rev. 1.5, 06-Sep-13
4
Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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